Alternative Optimization Techniques for Shallow Trench Isolation and Replacement Gate Technology Chemical Mechanical Planarization

Modeling of chemical mechanical polishing for shallow trench isolation

Chemical mechanical polishing (CMP) is a key process enabling shallow trench isolation (STI), which is used in current integrated circuit manufacturing processes to achieve device isolation. Excessive dishing and erosion in STI CMP processes, however, create device yield concerns. This thesis proposes characterization and modeling techniques to address a variety of concerns in STI CMP. Three ma...

Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Advanced Logic Technology

Shallow trench isolation (STI) requires a high quality oxide with superior fill capability provided by High Density Plasma (HDP) oxide. Unfortunately, the HDP deposition process can create large within die topographies that are difficult to polish directly using conventional silica slurries [1]. High Selective Slurries (HSS) were introduced in order to meet these stringent requirements and they...

Issues in Shallow Trench Isolation CMP

As advancing technologies increase the demand for planarity in integrated circuits, nanotopography has emerged as an important concern in shallow trench isolation (STI) on wafers polished by means of chemical–mechanical planarization (CMP). Previous work has shown that nanotopography—small surface-height variations of 10–100 nm in amplitude extending across millimeter-scale lateral distances on...

Laser Assisted Chemical Mechanical Polishing for Planarization

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...